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Solder Paste

Solder paste -1

Alloy: 63Sn/37Pb, 62Sn/36Pb/2Ag

Powder Size: Type 3 (25-45μm), Type 4(20-38μm)

Packaging sizes: 500 gram jars.

Excellent resistance to hot and cold slump for(Contour stability) minimizing bridge formation

Penetrable post reflow flux residues to maximize pin testability(ICT).
Solder paste -2

Alloy: 63Sn/37Pb

Powder Size: Type 3 (25-45μm)

Packaging sizes: 500 gram jars.

Product Viscosity: 190±30Pa.s

Metal melting point: 183℃
Solder paste -3

Alloy: 96.5Sn/3Ag/0.5Cu

Powder Size: Type 4 (20-38μm)

Packaging sizes: 500 gram jars.

Product Viscosity: 190±30Pa.s

Metal melting point: 217℃

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